Austriamicrosystems' Full Service Foundry announces that it is the first to adopt the Fabless Semiconductor Association (FSA) mixed-signal/RF Process Design Kit (PDK) guidelines for it's foundry customers. A PDK is a set ...
Jul 23, 2004
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With ever increasing demands for greater miniaturisation and the use of flexible circuitry the need for improved fabrication methods for high resolution printed circuit boards is becoming more important. By precise control ...
Jul 23, 2004
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RF Tuner chip can be use to receive both terrestrial and cable TV signals LSI Logic Corporation (NYSE: LSI), a leader in multimedia processing for the Digital Home, announced the industrys first highly integrated radio frequency ...
Jul 23, 2004
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SST (Silicon Storage Technology, Inc., NASDAQ: SSTI), a leader in flash memory technology, announced initial production and availability of its 64-Mbit Multi-Purpose Flash Plus (MPF+) product family. The 64-Mbit MPF+ SST39VF6401 ...
Jul 23, 2004
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Zeevo, Inc., a leading provider of single-chip Bluetooth communications solutions, announced today its third-generation, high performance Bluetooth microcontroller solution that is the first in the world to permit the transmission ...
Jul 23, 2004
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Background noise that interferes with cellphone conversations could be a thing of the past thanks to a dual microphone system developed at the University of Toronto.
Jul 23, 2004
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As temperatures soar this summer, so do electric bills. Researchers at the University of Houston are striving toward decreasing those costs with the next revolution in power generation. Imagine a power source so small, yet ...
Jul 23, 2004
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When electromagnetic propulsion was first demonstrated more than a century ago, it inspired science fiction dreams of rocket-less space launches, magnetic levitation (maglev) vehicles and super guns. Many years later, electromagnetic ...
Jul 23, 2004
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NEC Electronics Corporation (TSE: 6723) and its subsidiary in Europe, NEC Electronics (Europe) GmbH, announced the development of two new series of microcontrollers (MCUs), the µPD789863 and the µPD789864, designed to address ...
Jul 23, 2004
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NEC Electronics Corporation (TSE: 6723) and its subsidiary in Europe, NEC Electronics (Europe) GmbH, introduced the µPD161451 bridge IC for 3G mobile handsets, a chip that facilitates development of handsets with rotating ...
Jul 23, 2004
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